Development of packaging systems and interconnects for microfluidics applications

The objective of this research program is to develop effective packaging techniques and methodologies for selected micro-electro-mechanical systems (MEMS) used in microfluidics applications. The developed packaging system will be aimed at standardising the process of packaging for most of the microfluidics devices including microfluidic edge connectors and manifold dispensers, and their development will include the use of rapid prototyping technologies such as Fused Deposition Modelling. The work will be aimed at reducing the overall time and cost of developing and assembling the packaging system for microfluidics devices. The consideration of designs for polymer microfluidic connections and packaging will be described in this paper.