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Diffraction line profile analysis of 3D wedge samples of Ti-6Al-4V fabricated using four different additive manufacturing processes

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posted on 2024-07-11, 12:07 authored by Ryan Cottam, Suresh PalanisamySuresh Palanisamy, Maxim Avdeev, Tom Jarvis, Chad Henry, Dominic Cuiuri, Levente Balogh, Rizwan Abdul Rahman RashidRizwan Abdul Rahman Rashid
Wedge‐-shaped samples were manufactured by four different Additive Manufacturing (AM) processes, namely selective laser melting (SLM), electron beam melting (EBM), direct metal deposition (DMD), and wire and arc additive manufacturing (WAAM), using Ti‐-6Al‐-4V as the feed material. A high‐-resolution powder diffractometer was used to measure the diffraction patterns of the samples whilst rotated about two axes to collect detected neutrons from all possible lattice planes. The diffraction pattern of a LaB6 standard powder sample was also measured to characterize the instrumental broadening and peak shapes necessary for the Diffraction Line Profile Analysis. The line profile analysis was conducted using the extended Convolution Multiple Whole Profile (eCMWP) procedure. Once analyzed, it was found that there was significant variation in the dislocation densities between the SLMed and the EBMed samples, although having a similar manufacturing technique. While the samples fabricated via WAAM and the DMD processes showed almost similar dislocation densities, they were, however, different in comparison to the other two AM processes, as expected. The hexagonal (HCP) crystal structure of the predominant α‐-Ti phase allowed a breakdown of the percentage of the Burgers’ vectors possible for this crystal structure. All four techniques exhibited different combinations of the three possible Burgers’ vectors, and these differences were attributed to the variation in the cooling rates experienced by the parts fabricated using these AM processes.

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ISSN

2075-4701

Journal title

Metals

Volume

9

Issue

1

Article number

article no. 60

Pagination

60-

Publisher

MDPI AG

Copyright statement

Copyright © 2019 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).

Language

eng

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