Evaluation of adhesively bonded steel sheets using ultrasonic techniques

Adhesives have presently reached a stage where they have become part of everyday life both in a professional sense as well as for household applications. They offer advantages that in many respects surpass other joining processes such as bonding of large areas, joining a wide range and dissimilar materials; and without the need for special tooling or operator training, that is often required by many other joining processes. They are of course not a panacea to all fastening applications, but they can easily be described as the most versatile and most widely used joining method at present. Engineering applications have also benefited from the advantages offered by adhesives, but they are not as liberally used due to the severe consequences that may result from bond failure. Although adhesives can demonstrate their ability to fulfil the joining strength requirements under laboratory conditions, their application in industry proved to be not as reliable as expected. A number of parameters that can easily be controlled under laboratory conditions such as temperature, humidity, surface preparation and uniform adhesive application are not as easily observed in industry. Quality assurance during manufacturing can achieve excellent results; however even in these cases the probability of having adhesive bond defects is still present. Therefore, there is a need for post process inspection of adhesive bonds where risk levels require higher reliability than what is offered though process quality control. Adhesive bond inspection is a well researched area with respectable outcomes. Non destructive inspection techniques such as x-ray, thermal, and ultrasonic are well utilised in the inspection of adhesive bonds. However, despite all the effort in this area for more than forty years, there is still no singular technique that can achieve the confidence level required in some engineering applications. Therefore, the need for continuing research in the area of non-destructive evaluation of adhesive bonds is as necessary today as it has ever been. The research presented in this thesis, continues in the same endeavour as many other researchers; that of achieving the ultimate technique in adhesive bond inspection, capable of reaching the confidence level required for all engineering applications. The research in the thesis commenced with coverage of adhesives used for engineering applications and a study of the adhesion science that was considered necessary to enable an informed approach to the problem. Adhesive bond failure is also analysed through a literature survey as well as experimental tests on standard specimens. At the completion of the literature survey and preliminary tests, a decision was taken to follow the ultrasonic path of non-destructive testing of adhesive bonds. The reasons for this, are clearly outlined in the main body of this thesis but in summary, the literature has shown that ultrasonic evaluation is the most widely used technique by industry. Therefore, improvements on data analysis using existing techniques that exploit ultrasonic inspection have the potential to reach the widest spectrum of industrial applications. Ultrasonic inspection equipment was sourced that was capable of achieving experimental results to the accuracy level required in this research. A precision test rig was designed and constructed that was subsequently calibrated using computer based statistical techniques to ensure the validity of all results. Other ancillary equipment, such as a portable tensile testing device were also designed and constructed during the research as it became necessary. Research concentrated on techniques found to be inadequately researched in this domain. The first technique evaluated was to measure bond quality through the stress distribution in adherent and adhesive. Computer based Finite Element Analysis showed that the ability to detect variation in stress distribution at the adhesion interface is capable of revealing the local bond strength. Having found that there is no technique available at present that can measure the stress distribution at the interface, a different direction was taken that showed potential in achieving excellent quantitative results in the analysis of ultrasonic signals from adhesive bonds. This technique was rigorously evaluated and the results are systematically reported in this work.