Process Optimization on Chemical Mechanical Polishing (CMP) for Alleviating the Post-polishing Substrate-platen Adhesion

This study addresses a common problem in disk production where disks stick to machines after polishing. The research identifies key factors that reduce this sticking issue and improve product quality. The study reveals that polishing surface speed significantly influences disk adhesion. This discovery offers a practical solution to a widespread industry challenge, potentially enhancing manufacturing efficiency and reducing product waste. The research also introduces a new method to measure the impact of polishing speed on disk sticking, paving the way for future improvements in disk production processes.