Response surface methodology optimization of back end of line finite element analysis stress simulation

The research focused on improving structural mechanics robustness of semiconductor devices through the use of simulation. Simulation prior to physical prototyping reduces wastage of manpower and material resources. This approach however, results in the need for a computational resource. The novel methodology used in this work involved the combined use of a numerical method i.e. finite element analysis and an advanced statistical method i.e. response surface methodology to overcome the shortage of computational resources. The outcome allowed computational resources to be optimized as well reducing the number of physical prototypes built.